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Decorative Copper Electroplating Systems

Copper is one of the few colored metals. It is relatively soft and ductile and alloys readily with other metals to produce, for example, brasses and bronzes; it has excellent electrical and thermal conductivity. Copper can be electrodeposited as a bright or a dull coating and it is used for both decorative and industrial purposes.

New Product release - cumac optima bright acid copper

 

Market Leading Levelling and Low Current Density Brightness

 

chrome free etching

 Advantages

  • Ultra High Levelling System
  • Exceptional Low Current Density Brightness
  • Production Proven
  • Ductile Deposit
  • For Plating on Plastics and Zinc-based Diecastings
 
High Levelling Acid Copper, Start Bright...Finish Right

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Primary uses for electroplated copper

 

ApplicationCopper TypeMacDermid SystemMain Attributes
Plating on Plastics Bright Acid Copper CuMac Optima Thicknesses above 25um as an undercoat for subsequent nickel layers. Ensures good thermal cycling for the electroplated plastic.
Aluminum Wheels Bright Acid Copper CuMac Optima Levels out surface imperfections to help ensure a mirror bright nickel / chromium electrodeposit. Can be polished before nickel electroplating.
Zinc-Based Diecastings Bright Acid Copper CuMac Optima Levels out surface imperfections to help ensure a mirror bright nickel / chromium electrodeposit. Can be used over either pyrophosphate or cyanide copper layer.
Zinc-Based Diecastings Bright Pyrophosphate Copper Clepo SP Levels out surface imperfections to help ensure a mirror bright nickel / chromium electrodeposit. Used over cyanide copper layer.
Zinc-Based Diecastings Semi-bright or Matt Cyanide Copper Metex S-1 Strike layer, usually overplated with acid or pyrophosphate copper.
Coin manufacture Semi-bright or Matt Cyanide Copper Metex S-1 Usually plated to very thick deposits before subsequent mass burnishing / annealing.
Electroforming Bright Acid Copper CuMac GR-3 Used at high current densities (up to 500 amp/sq2) to quickly produce thick deposits. The deposit is uniformly bright and leveled.
Gravure Bright Acid Copper CuMac G-25 Produces thick copper deposits with a hardness of 210 - 220 Hv which are highly resistant to self-annealing and have good engraving characteristics.

 

 

CCuMac Optima bright acid copper platinguMac Optima

MacDermid Decorative Products continue to demonstrate their unrivalled expertise in electroplating process development with the introduction of CuMac Optima.

This latest generation acid copper has ultra-levelling capability, ideal for plating of zinc diecast, plastics and all other substrates requiring maximum deposit brilliance.

CuMac Optima offers exceptional low current density levelling and superb brightness, perfect for complex shapes and deeply recessed parts.

 

 Clepo SP

Clepo SP is a cyanide-free pyrophosphate copper bath suitable for application over a cyanide copper strike on steel or zinc diecastings or over a nickel strike on steel or brass. It can also be used for directly over aluminum treated with Bondal or Bondal CF.

Clepo SP produces bright, well levelled copper deposits which can be subsequently plated with bright acid copper or semi-bright / bright nickel.

 

 

Metex S-1

Cyanide copper

Metex S-1 Semi-Bright Cyanide Copper Process provides a method of plating fine grain semi-bright copper from cyanide solutions at a high rate of deposition, freedom from pitting and roughness, and with ease of control.

The deposit is excellent as a stop-off before case hardening. The process can also be used when a substantial deposit of nickel is to be plated directly over the copper deposit.

 

CuMac G-25

CuMac G-25 is a high performance acid copper plating process which has been specifically designed for the copper plating of gravure cylinders.

The process produces copper deposits with a hardness of 210 – 220 Hv which are highly resistant to self-annealing and have good engraving characteristics.

It is particularly suitable for high build copper thicknesses (above 100 microns). The system is simple to operate using only one liquid additive and chloride ions for maintenance of the bright, fine grained copper deposit. 

 

CuMac GR-3

copper electroplating

CuMac GR-3 Acid Copper Process is used when plating at high current densities and elevated temperatures.

The CuMac GR-3 system offers a single brighter additive for use in high conductive electrolytes at temperatures up to 60°C and current densities up to 500 amp/sq2

The deposit produced with CuMac GR-3 is uniformly bright and level, especially at high ranges. The CuMac GR-3 brightener system is formulated to allow deposition of a bright, level plate at higher current densities and higher temperatures than other brightener systems allow.