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ABS | PC Alloys
MacuPlex pretreatment systems are used to metalize both ABS and ABS/PC alloys in the same process line. After etching the surface (to provide a tough bond), traces of a precious metal are laid down. This precious metal provides the 'seeds' for deposition of a thin layer of nickel or copper by electroless deposition.
Etching is achieved in a strongly acidic solution to which special wetters to reduce surface tension are added. The acid is neutralized, before the precious metal is deposited onto the surface. Typically nickel is used at the electroless stage. However in when large components are plated, copper is recommended due to its higher conductivity.
