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Advanced POP Technology 3D-MID

3D-Molded Interconnect Devices consist of circuit traces embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components.

Designing systems with 3D-MID components allows designers to reduce the size, weight, number of components and complexity and to decrease in assembly times and cost by having fewer components, wires and interconnects to assemble.

Selectconnect Paper

Medical Design Brief

MacDermid's MID processes are specifically designed and optimized to deliver high yields, precise selectivity and ease-of-use for laser direct structuring and double shot molded interconnect devices.

WHAT THIS NEW TECHNOLOGY OFFERS

Cost Reductions

Experiment with design of traces and shielding without having to invest in expensive tooling changes
Facilitates mass manufacturing

QUALITY IMPROVEMENTS

Designers can choose from a wider variety of thermoplastic materials
Combine electrical and mechanical functionality
Maximize the use of space where components are placed at different heights and in different declinations

APPLICATIONS

AEROSPACE

MID technology eliminates many limitations imposed by traditional metal-based connectors, replacing them with selectively plated moldable plastics and other composite materials.